Tõkei, L: search on Z-Library

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1

[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Feasibility study of fully self aligned vias for 5nm node BEOL

Murdoch, Gayle, Bommels, Jurgen, Wilson, Christopher J., Gavan, Khashayar Babaei, Le, Quoc Toan, Tokei, Zsolt, Clark, William

Year:

2017

Language:

english

File:

PDF, 432 KB

english, 2017

2

Democracy and Socialism in Georg Lukács' Political Philosophy

Journal:

Science & Society

Year:

1990

Language:

english

File:

PDF, 977 KB

english, 1990

3

Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle

Croes, K., Cannatá, G., Zhao, L., Tőkei, Zs.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 192 KB

english, 2008

4

Some contentious issues in the interpretation of the asiatic mode of production

Journal:

Journal of Contemporary Asia

Year:

1982

Language:

english

File:

PDF, 672 KB

english, 1982

5

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Challenges and novel approaches for photo resist removal and post-etch residue removal for 22 nm interconnects

Mertens, P.W., Kim, T.-G., Claes, M., Le, Q. T., Vereecke, G., Kesters, E., Suhard, S., Pacco, A., Lux, M., Kenis, K., Urbanowicz, A., Tokei, Zs., Beyer, G.

Year:

2009

Language:

english

File:

PDF, 333 KB

english, 2009

6

Reliability challenges for copper low-k dielectrics and copper diffusion barriers

Zs. Tökei, Y.-L. Li, G.P. Beyer

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 288 KB

english, 2005

7

Increasing the mean grain size in copper films and features

Vanstreels, K., Brongersma, S.H., Tokei, Zs., Carbonell, L., De Ceuninck, W., D’Haen, J., D’Olieslaeger, M.

Journal:

Journal of Materials Research

Year:

2008

Language:

english

File:

PDF, 2.92 MB

english, 2008

8

[IEEE ESSDERC 2014 - 44th European Solid State Device Research Conference - Venice Lido, Italy (2014.9.22-2014.9.26)] 2014 44th European Solid State Device Research Conference (ESSDERC) - Circuit and process co-design with vertical gate-all-around nanowire FET technology to extend CMOS scaling for 5nm and beyond technologies

Bao, T. Huynh, Yakimets, D., Ryckaert, J., Ciofi, I., Baert, R., Veloso, A., Boemmels, J., Collaert, N., Roussel, P., Demuynck, S., Raghavan, P., Mercha, A., Tokei, Z., Verkest, D., Thean, A. V-Y., Wa

Year:

2014

Language:

english

File:

PDF, 3.66 MB

english, 2014

9

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Impact of Via Density on the Mechanical Integrity of Advanced Back-End-of-Line During Packaging

Kljucar, Luka, Gonzalez, Mario, Croes, Kristof, Wolf, Ingrid De, Murdoch, Gayle, Vos, Joeri De, Bommels, Jurgen, Beyne, Eric, Tokei, Zsolt

Year:

2016

Language:

english

File:

PDF, 1.60 MB

english, 2016

10

[IEEE 2020 IEEE International Reliability Physics Symposium (IRPS) - Dallas, TX, USA (2020.4.28-2020.5.30)] 2020 IEEE International Reliability Physics Symposium (IRPS) - Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill

Lesniewska, A., Roussel, P.J., Tierno, D., Gonzalez, V. Vega, van der Veen, M. H., Verdonck, P., Jourdan, N., Wilson, C.J., Tokei, Zs., Croes, K.

Year:

2020

File:

PDF, 865 KB

2020

11

Water consumption of sweet cherry trees estimated by sap flow measurement

Juhász, Ágota, Sepsi, Panna, Nagy, Zoltan, Tőkei, Laszló, Hrotkó, Károly

Journal:

Scientia Horticulturae

Year:

2013

Language:

english

File:

PDF, 1.07 MB

english, 2013

12

Cu passivation for integration of gap-filling ultralow-k dielectrics

Zhang, Liping, de Marneffe, Jean-Francois, Lesniewska, Alicja, Verdonck, Patrick, Heylen, Nancy, Murdoch, Gayle, Croes, Kristof, Boemmels, Juergen, Tokei, Zsolt, De Gendt, Stefan, Baklanov, Mikhail R.

Journal:

Applied Physics Letters

Year:

2016

Language:

english

File:

PDF, 1.54 MB

english, 2016

13

Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers

Larry Zhao, Melina Lofrano, Kristof Croes, Els Van Besien, Zsolt Tőkei, Christopher J. Wilson, Robin Degraeve, Thomas Kauerauf, Gerald P. Beyer, Cor Claeys

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 1.14 MB

english, 2011

14

[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Integration of a low permittivity spin-on embedded hardmask for Cu/SiLK resin dual damascene

Waeterloos, J.J., Shaffer, E.O., Stokich, T., Hetzner, J., Price, D., Booms, L., Donaton, R.A., Beyer, G., Coenegrachts, B., Caluwaerts, R., Struyf, H., Tokei, Z.S., Vervoort, I., Sijmus, B., Vos, I.,

Year:

2001

Language:

english

File:

PDF, 279 KB

english, 2001

15

Initial Oxidation of a 9%CrMo- and a 12%CrMoV-Steel

Grabke, Hans Jürgen, Tökei, Zsolt, Ostwald, Carmen

Journal:

steel research international

Year:

2004

Language:

english

File:

PDF, 2.13 MB

english, 2004

16

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability

Tang, B.J., Croes, K., Barbarin, Y., Wang, Y.Q., Degraeve, R., Li, Y., Toledano-Luque, M., Kauerauf, T., Bömmels, J., Tőkei, Zs., De Wolf, I.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 687 KB

english, 2014

17

Defectivity Study of Cu Metallization Process by Dark- and Bright-Field Inspection

Carbonell, Laureen, Holsteyns, Frank, Tőkei, Zsolt, O'Reilly, Lisa, Maex, Karen, Mertens, Paul W.

Journal:

Solid State Phenomena

Year:

2003

File:

PDF, 367 KB

2003

18

Statistical Timing Analysis Considering Device and Interconnect Variability for BEOL Requirements in the 5-nm Node and Beyond

Huynh-Bao, Trong, Ryckaert, Julien, Tokei, Zsolt, Mercha, Abdelkarim, Verkest, Diederik, Thean, Aaron Voon-Yew, Wambacq, Piet

Journal:

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Year:

2017

Language:

english

File:

PDF, 4.25 MB

english, 2017

19

[IEEE 2014 IEEE International Reliability Physics Symposium (IRPS) - Waikoloa, HI, USA (2014.6.1-2014.6.5)] 2014 IEEE International Reliability Physics Symposium - Towards the understanding of intrinsic degradation and breakdown mechanisms of a SiOCH low-k dielectric

Wu, C., Li, Y., Barbarin, Y., Ciofi, I., Tang, B., Kauerauf, T., Croes, K., Bommels, J., De Wolf, I., Tokei, Zs.

Year:

2014

Language:

english

File:

PDF, 1.36 MB

english, 2014

20

[AIP SYNCHROTRON RADIATION INSTRUMENTATION: Ninth International Conference on Synchrotron Radiation Instrumentation - Daegu (Korea) (28 May-2 June 2006)] AIP Conference Proceedings - Preliminary Hard X-ray Micro-spectroscopic Investigations on Thin-Film Ta-and-W Based Diffusion Barriers for Copper Interconnect Technology

Ablett, James M., Woicik, Joseph C., Tokei, Zsolt

Year:

2007

Language:

english

File:

PDF, 275 KB

english, 2007

21

[IEEE 2015 IEEE Custom Integrated Circuits Conference - CICC 2015 - San Jose, CA, USA (2015.9.28-2015.9.30)] 2015 IEEE Custom Integrated Circuits Conference (CICC) - Holisitic device exploration for 7nm node

Raghavan, P., Bardon, M. Garcia, Jang, D., Schuddinck, P., Yakimets, D., Ryckaert, J., Mercha, A., Horiguchi, N., Collaert, N., Mocuta, A., Mocuta, D., Tokei, Z., Verkest, D., Thean, A., Steegen, A.

Year:

2015

Language:

english

File:

PDF, 995 KB

english, 2015

22

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - Barrier/liner stacks for scaling the Cu interconnect metallization

van der Veen, Marleen H., Jourdan, N., Gonzalez, V. Vega, Wilson, C. J., Heylen, N., Pedreira, O. Varela, Struyf, H., Croes, K., Bommels, J., Tokei, Zs.

Year:

2016

Language:

english

File:

PDF, 2.29 MB

english, 2016

23

Direct metal etch of ruthenium for advanced interconnect

Paolillo, Sara, Wan, Danny, Lazzarino, Frédéric, Rassoul, Nouredine, Piumi, Daniele, Tőkei, Zsolt

Journal:

Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures

Year:

2018

Language:

english

File:

PDF, 2.45 MB

english, 2018

24

Failure mechanisms of PVD Ta and ALD TaN barrier layers for Cu contact applications

C. Zhao, Zs. Tőkei, A. Haider, S. Demuynck

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 479 KB

english, 2007

25

[IEEE 2016 IEEE International Reliability Physics Symposium (IRPS) - Pasadena, CA, USA (2016.4.17-2016.4.21)] 2016 IEEE International Reliability Physics Symposium (IRPS) - New breakdown mechanism investigation: Barrier metal penetration induced soft breakdown in low-k dielectrics

Wu, C., Li, Y., Bommels, J., De Wolf, I., Tokei, Zs., Croes, K.

Year:

2016

Language:

english

File:

PDF, 792 KB

english, 2016

26

[American Vacuum Soc 2001 6th International Symposium on Plasma- and Process-Induced Damage - Monterey, CA, USA (13-15 May 2001)] 2001 6th International Symposium on Plasma- and Process-Induced Damage (IEEE Cat. No.01TH8538) - Plasma charging damage issues in copper single and dual damascene, oxide and low-k dielectric interconnects

Van den Bosch, G., De Jaeger, B., Tokei, Z., Groeseneken, G.

Year:

2001

Language:

english

File:

PDF, 488 KB

english, 2001

27

[IEEE 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - Phoenix, AZ, USA (2007.04.15-2007.04.19)] 2007 IEEE International Reliability Physics Symposium Proceedings. 45th Annual - On the Interaction Between Inter-Metal Dielectric Reliability and Electromigration Stress

Li, Yunlong, Bruynseraede, Christophe, Groeseneken, Guido, Maex, Karen, Tokei, Zsolt

Year:

2007

Language:

english

File:

PDF, 481 KB

english, 2007

28

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - CVD-Mn/CVD-Ru-based barrier/liner solution for advanced BEOL Cu/Low-k interconnects

Jourdan, N., van der Veen, M.H., Vega Gonzalez, V., Croes, K., Lesniewska, A., Varela Pedreira, O., Van Elshocht, S., Bommels, J., Tokei, Zs.

Year:

2016

Language:

english

File:

PDF, 778 KB

english, 2016

29

[IEEE 2019 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2019.3.31-2019.4.4)] 2019 IEEE International Reliability Physics Symposium (IRPS) - Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch

Beyne, Sofie, Pedreira, Olalla Varela, De Wolf, Ingrid, Tokei, Zsolt, Croes, Kristof

Year:

2019

Language:

english

File:

PDF, 2.73 MB

english, 2019

30

Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

Christopher J. Wilson, Chao Zhao, Henny Volders, Larry Zhao, Kristof Croes, Zsolt Tőkei, Gerald P. Beyer

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 794 KB

english, 2011

31

Layout dependency induced deviation from Poisson area scaling in BEOL dielectric reliability

Y.-L. Li, Zs. Tökei, Ph. Roussel, G. Groeseneken, K. Maex

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 688 KB

english, 2005

32

Effects of Bias, Pressure and Temperature in Plasma Damage of Ultra Low-k Films

Urbanowicz, A.M., Humbert, A., Mannaert, G., Tokei, Z., Baklanov, Mikhail R.

Journal:

Solid State Phenomena

Year:

2008

Language:

english

File:

PDF, 591 KB

english, 2008

33

[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - Electromigration and Thermal Storage Study of Barrierless Co Vias

Pedreira, O. Varela, Croes, K., Zahedmanesh, H., Vandersmissen, K., van der Veen, M. H., Gonzalez, V. Vega, Dictus, D., Zhao, L., Kolies, A., Tokei, Zs.

Year:

2018

Language:

english

File:

PDF, 1.97 MB

english, 2018

34

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Vandevelde, Bart, Ivankovic, A., Debecker, B., Lofrano, M., Vanstreels, K., Guo, W., Cherman, V., Gonzalez, M., Van der Plas, G., De Wolf, I., Beyne, E., Tokei, Z.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.27 MB

english, 2014

35

[IEEE 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Grenoble, France (2015.5.18-2015.5.21)] 2015 IEEE International Interconnect Technology Conference and 2015 IEEE Materials for Advanced Metallization Conference (IITC/MAM) - Variability of quadruple-patterning interconnect processes

Baert, Rogier, Ciofi, Ivan, Wilson, Christopher J., Gonzalez, Victor Vega, Bommels, Jurgen, Tokei, Zsolt, Ryckaert, Julien, Raghavan, Praveen, Mercha, Abdelkarim, Verkest, Diederik

Year:

2015

Language:

english

File:

PDF, 177 KB

english, 2015

36

Thickness dependence of the resistivity of platinum-group metal thin films

Dutta, Shibesh, Sankaran, Kiroubanand, Moors, Kristof, Pourtois, Geoffrey, Van Elshocht, Sven, Bömmels, Jürgen, Vandervorst, Wilfried, Tőkei, Zsolt, Adelmann, Christoph

Journal:

Journal of Applied Physics

Year:

2017

Language:

english

File:

PDF, 2.08 MB

english, 2017

37

[IEEE 2006 IEEE International Integrated Reliability Workshop Final Report - South Lake Tahoe, CA, USA (2006.10.16-2006.09.19)] 2006 IEEE International Integrated Reliability Workshop Final Report - Bias Stress Induced Conduction Mechanism Evolution in Silica Based Inter-Metal Dielectrics

Li, Yunlong, Groeseneken, Guido, Maex, Karen, Tokei, Zsolt

Year:

2006

Language:

english

File:

PDF, 4.05 MB

english, 2006

38

[IEEE 2009 IEEE International Interconnect Technology Conference - IITC - Sapporo, Japan (2009.06.1-2009.06.3)] 2009 IEEE International Interconnect Technology Conference - Impact of LER on BEOL dielectric reliability: A quantitative model and experimental validation

Tokei, Zs., Roussel, Ph., Stucchi, M., Versluijs, J., Ciofi, I., Carbonell, L., Beyer, G.P., Cockburn, A., Agustin, M., Shah, K.

Year:

2009

Language:

english

File:

PDF, 262 KB

english, 2009

39

[IEEE 2015 IEEE International Reliability Physics Symposium (IRPS) - Monterey, CA, USA (2015.4.19-2015.4.23)] 2015 IEEE International Reliability Physics Symposium - Constant voltage electromigration for advanced BEOL copper interconnects

Tang, B. J., Croes, K., Jourdan, N., Bommels, J., Tokei, Zs., De Wolf, I., Wilcox, E., McMullen, T.

Year:

2015

Language:

english

File:

PDF, 630 KB

english, 2015

40

[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - Stress mitigation of 3D-stacking/packaging induced stresses

Croes, K., Cherman, V., Lofrano, M., Zahedmanesh, H., Kljucar, L., Gonzalez, M., De Wolf, I., Tokei, Zs., Beyne, E.

Year:

2018

Language:

english

File:

PDF, 696 KB

english, 2018

41

[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - Damascene Benchmark of Ru, Co and Cu in Scaled Dimensions

van der Veen, Marleen H., Heyler, N., Pedreira, O. Varela, Ciofi, I., Decoster, S., Gonzalez, V. Vega, Jourdan, N., Struyf, H., Croes, K., Wilson, C. J., Tokei, Zs.

Year:

2018

Language:

english

File:

PDF, 1.67 MB

english, 2018

42

[IEEE 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - San Jose, CA, USA (2016.5.23-2016.5.26)] 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC) - End of Cu roadmap and beyond Cu

Year:

2016

Language:

english

File:

PDF, 321.92 MB

english, 2016

43

Dependence of the minimal PVD TA(N) sealing thickness on the porosity of Zirkon™ LK dielectric films

F Iacopi, C Zistl, C Jehoul, Zs Tokei, Q.T Le, A Das, C Sullivan, G Prokopowicz, D Gronbeck, M Gallagher, J Calvert, K Maex

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 718 KB

english, 2002

44

[IEEE 2014 72nd Annual Device Research Conference (DRC) - Santa Barbara, CA, USA (2014.6.22-2014.6.25)] 72nd Device Research Conference - Lateral versus vertical gate-all-around FETs for beyond 7nm technologies

Yakimets, D., Bao, T. Huynh, Bardon, M. Garcia, Dehan, M., Collaert, N., Mercha, A., Tokei, Z., Thean, A., Verkest, D., De Meyer, K.

Year:

2014

Language:

english

File:

PDF, 458 KB

english, 2014

45

[IEEE 2010 IEEE International Reliability Physics Symposium - Garden Grove (Anaheim), CA, USA (2010.05.2-2010.05.6)] 2010 IEEE International Reliability Physics Symposium - E- and √E-model too conservative to describe low field time dependent dielectric breakdown

Croes, K., Tokei, Zs.

Year:

2010

Language:

english

File:

PDF, 500 KB

english, 2010

46

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation

Zahedmanesh, Houman, Gonzalez, Mario, Ciofi, Ivan, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 1.13 MB

english, 2016

47

[IEEE Proceedings of the IEEE 2006 International Interconnect Technology Conference - Burlingame, CA (2006.06.5-2006.06.7)] 2006 International Interconnect Technology Conference - Low-k properties and integration processes enabling reliable interconnect scaling to the 32 nm technology node

Ikeda, A., Travaly, Y., Humbert, A., Hoofman, R.J.O.M., Li, Y.L., Tokei, Zs., Iacopi, F., Michelon, J., Bruynseraede, C., Willegems, M., Hendrickx, D., Van Aelst, J., Struyf, H., Versluijs, J., Heylen

Year:

2006

Language:

english

File:

PDF, 413 KB

english, 2006

48

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Line Edge Roughness (LER) correlation and dielectric reliability with Spacer-Defined Double Patterning (SDDP) at 20nm half pitch

Siew, Yong Kong, Stucchi, Michele, Versluijs, Janko, Roussel, Philippe, Kunnen, Eddy, Pantouvaki, Marianna, Beyer, Gerald P., Tokei, Zsolt

Year:

2011

Language:

english

File:

PDF, 387 KB

english, 2011

49

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line

Ključar, Luka, González, Mario, De Wolf, Ingrid, Croes, Kristof, Bömmels, Jürgen, Tőkei, Zsolt

Journal:

Microelectronics Reliability

Year:

2016

Language:

english

File:

PDF, 975 KB

english, 2016

50

Integration of Cu and low-k dielectrics: effect of hard mask and dry etch on electrical performance of damascene structures

R.A. Donaton, B. Coenegrachts, M. Maenhoudt, I. Pollentier, H. Struyf, S. Vanhaelemeersch, I. Vos, M. Meuris, W. Fyen, G. Beyer, Z. Tokei, M. Stucchi, I. Vervoort, D. De Roest, K. Maex

Journal:

Microelectronic Engineering

Year:

2001

Language:

english

File:

PDF, 857 KB

english, 2001

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